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PCB Assembly Quote

Three Options:

  • Turnkey

    Cyber supply the parts

  • Kitted/Consigned

    Customer supply parts

  • Combo

    Customer supply some parts Cyber do the rest

Please complete the data to get an instant PCB Assembly quote.

*Quantity: ?

Single Piece
pcs

The PCB assembly quantity should be equal to or less than the PCB quantity.

*Size (single):
x
mm
Assembly Side(s): Single Side Double Side
Stencil: ?

Provided free of charge.
Cyber supply
+Add PO No.:

Chip number parameters

* Number of Unique Parts ?

The number of component types on each board (listed in the BOM)
Number of SMD Parts: ?

The total number of SMDs on each board (including fine pitch and leadless)
Number of BGA/QFP Parts?

The number of ICs with more than 16pins and SMD irregular parts with more than 10pins on each board. (SOP,QFP,QFN,BGA)
Number of Through-Hole Parts: ?

The total number of THT parts on each board (DIP NO.)

Additional Options

Depanel the boards to delivery:?

Sub-board shipment: The panelized PCB is divided into pieces and packaged separately to ship out after the assembly service.
Function test:?

Functional testing is done mainly to avoid assembly issues including shorts, opens, missing components or the installation of incorrect parts.Please note your functional test methods and detailed requirements if needed.
Conformal coating:?

Conformal Coating is a specially formulated coating used to protect PCBs, assembled boards or related equipment from environmental erosion. It has good high and low temperature resistance; After curing, it forms a transparent protective film, which has excellent insulation, moisture-proof, dust-proof, anti-corrosion, anti-aging and other properties.
Firmware loading:?

Get the assembled PCBs programmed to realize the required functions or program Test Jigs for function testing.
Cable Wire Harness Assembly:?

We can provide standard and simple wiring harness assembly, or custom wire harnesses assembly and cable assembly at shortest turnaround times. A cable assembly is a group of wires or cables covered by an exterior sleeve made from a variety of material. A wire harness is a single cable covered by an exterior sleeve.
Box Build Assembly:?

This service ranges from small enclosures where two plastic mouldings encase a PCB to larger more complex fabricated box build assembly. The box build is also known as systems integration, and the box build assembly refers to the whole assembly of the finished products. Box build assembly is a full process service from PCB manufacturing, parts procurement, PCB SMT, assembly, testing and package.
Press-fit connectors assembly?

Press-fit connectors assembly: Press-fit technology allows to avoid soldering when assembling PCB electronics. The press-fit connection is formed when a pin is pressed into a fitted, plated-through hole in a PCB.
X-ray Testing：?

We would test the first one, the middle one and the last by default for free.
Other Requests:
Standard PCB Quote
Base Material:

FR4 is the most commonly used dielectric material for fabricating circuit boards.

Aluminum boards exhibit superior heat dissipation and thermal transfer compared to standard FR-4 constructions.

Copper-based boards have even higher thermal conductivity than aluminum PCBs.

Rogers, known for its low dielectric loss, is frequently employed in high-frequency PCBs.

 param picture FR-4 param picture HDI (Buried/Blind Vias) param picture Aluminum param picture Copper Core param picture Rogers
Different Design:

Fill in how many different designs you have in your Gerber file, divided by V-cuts, stamp holes, or milled slots.
Example
Layers:

The number of copper layers in the board.

If you require more than 14 layers, please choose the Premium PCB Quote page for a quote.

 1 2 4 6 8 10 12 14
Layers:

The number of copper layers in the board.

 1 2
Layers:

The number of copper layers in the board.

 2
Structure Type:

Type I: Defines a single microvia layer on either one or both sides of core. Uses both plated microvia and PTH for interconnection, employing blind, but not buried vias.

Type II: Defines a single microvia layer on either one or both sides of core. Uses both plated microvia and PTH for interconnection. Employs blind and buried vias.

Type III: Defines at least two layers of microvia on either one or both sides of core. Uses both plated microvia and PTH for interconnection. Employs blind and buried vias.

 Type I Type II Type III
FR4-TG:

TG stands for Glass Transition Temperature.

The typical TG is 130℃ or higher, while medium TG is generally greater than 150℃, and advanced TG is typically above 170℃. The material's temperature resistance improves as the TG increases.

Our default material boasts a TG of 150-160℃, surpassing the majority of other companies.

 TG135-140 TG150-160 TG170-180
Rogers:

Non-conductive base material

 Rogers 4003C Rogers 4350B
Delivery Type:

The delivery type refers to the method by which you request CyberPCB to produce and deliver your PCB design.

Single PCB:  Your design will be produced and delivered as individual PCBs.

Panel by Customer:  You are responsible for constructing the PCB panel and providing us with the panelized data for production.

Panel by CyberPCB:  We will construct the panel for you, incorporating v-cuts based on your requirements. (Please note that we only offer panelizing services for PCBs with regular shapes such as rectangles and circles. For PCBs with irregular shapes, you will need to panelize them yourself.)

 Single Piece Panel By Customer Panel By CyberPCB
Size(single):

The board size is determined by the customer and represents the length and width of the board. 

For circular boards, it corresponds to the diameter of the circle. 

In the case of boards with irregular shapes, the measurements are based on the maximum dimensions of the shape.

 x
inch'↔mm
Single Pcb Size
Quantity(panel):

Quantity of single or panelized boards needed for the order.
sets
Panel Format:

Please specify the number of columns/rows in the PCB panel array. For example:
Panel Format
Columns:
x
Rows:
Edge Rail:

Edge rails are located at the board edges to facilitate easier fixation of the boards onto a machine. The rails can be easily cut after assembly.
Route Process:

The PCBs within the panel are interconnected as depicted in the following diagram:

 None Panel as V-Scoring Panel as Tab-Route Both V-Scoring & Tab-Routing
X-out Panel:

There is a possibility of defective PCBs within the panel.

If you choose not to accept the X-out in the panel, the cost will increase accordingly.

 Accept Not Accept

PCB Process Information

PCB Thickness:

The board thickness represents the final thickness of the PCB after production, with an approximate error of 10% (+/-10% for T>=1mm or +/- 0.1mm for T<1mm). This error primarily stems from solder mask and copper sinking.

If you have specific thickness error requirements, kindly include them in the "Other Requirements" section.

PCB Thickness

 0.4 0.6 0.8 1.0 1.2 1.6 2.0 2.4 3.0 3.2
PCB Thickness:

The thickness of the final board. The tolerance is +/-10%.

 0.203 0.305 0.508 0.813 1.524
PCB Thickness:

 The thickness of the final board. The tolerance is +/-10%.

 0.254 0.338 0.508 0.762 1.524
Solder Mask:

The solder mask color refers to the color applied to the surface of the PCB.

Green and white are the available default colors for the solder mask. Selecting any other color will incur an additional fee.

 Green Red Yellow Blue White Matt Black Black Purple Matt Green param picture None
Solder Mask:

The solder mask color refers to the color applied to the surface of the PCB.

 White Warm White Black
Solder Mask:

The solder mask color refers to the color applied to the surface of the PCB.

 Green White Warm White Black
Silkscreen:

In most cases, the silkscreen is printed in white on the PCB. 

However, when using a white solder mask, the silkscreen is printed in black. 

It's important to note that the white silkscreen may appear less distinct on a gray surface. It is not recommended to have a silkscreen on the bare aluminum surface.

Silkscreen

 White Black Yellow param picture None
Silkscreen:

White and black colors are available at no additional cost and are set as the default options. If you choose any other colors, an additional fee will be applied. It's important to note that the silkscreen and solder mask must be in different colors.

 White Black param picture None
Surface Finish:

Surface finish plays a crucial role in PCB production as it serves multiple purposes. Firstly, it acts as a protective layer to prevent copper oxidation, which could render the PCB non-functional. Secondly, it provides a smooth surface that facilitates the soldering of components onto the PCB.

HASL (Hot Air Solder Leveling) is a cost-effective surface finishing option that involves the application of a thin protective layer of tin/lead on the PCB.

ENIG (Electroless Nickel Immersion Gold) has emerged as the industry's preferred surface finish due to its advantages, including a flat surface, lead-free and RoHS compliance, extended shelf life, and the ability to maintain tighter tolerances for plated holes.

OSP(Organic Solderability Preservatives) is also known as anti-tarnish. It involves the formation of an organic protective layer on clean and bare copper through adsorption.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is a surface finish similar to ENIG (Electroless Nickel Immersion Gold) in that both processes involve the deposition of electroless nickel on top of copper plating. The key distinction is that while ENIG has gold directly deposited on top of the nickel layer, ENEPIG incorporates an additional layer of palladium between the nickel and final gold layer.

 HASL With Lead HASL Lead Free ENIG OSP Bare Copper ENEPIG Immersion Silver Immersion Tin HASL Lead Free + Selective Immersion Gold
Thickness Of Immersion Gold: 1U" 2U" 3U"
Thickness Of ENEPIG: Ni:200U" Pd:1U" Au:1U" Ni:200U" Pd:2U" Au:2U" Ni:200U" Pd:3U" Au:3U" Ni:200U" Pd:4U" Au:4U"
Thickness Of Immersion Gold: 1U" 2U" 3U"
Min Spacing:

The minimum width of the copper trace and the minimum spacing between two traces.

Our engineers will verify the minimum spacing.

Min Spacing

 3.5/3.5mil 4/4mil 5/5mil 6/6mil↑ 8/8mil↑ 10/10mil↑ 20/20mil↑
Min Spacing:

 The minimum width of the copper trace and the minimum spacing between two traces.

Our engineers will verify the minimum spacing.

Min Spacing

 5/5mil 10/10mil 16/16mil 20/20mil
Min Hole Size:

The minimum via diameter.

Our engineers will verify the minimum hole size.

Min Hole Size

 0.15mm 0.2mm 0.25mm 0.3mm
Min Hole Size:

The minimum via diameter.

Our engineers will verify the minimum hole size.

Min Hole Size

 1.0mm 1.2mm 1.5mm↑
Outer Copper:

The copper weight, measured in ounces per square foot, determines the thickness of copper on the outer layers of the PCB.

 1oz 2oz 3oz 4oz 5oz 6oz
Outer Copper:

 The copper weight, measured in ounces per square foot, determines the thickness of copper on the outer layers of the PCB.

 0.5oz 0.75oz 1oz 2oz 3oz 4oz
Outer Copper:

The copper weight, measured in ounces per square foot, determines the thickness of copper on the outer layers of the PCB.

 1oz 2oz
Outer Copper:

The copper weight, measured in ounces per square foot, determines the thickness of copper on the outer layers of the PCB.

 1oz
Inner Copper:

The copper weight refers to the amount of copper on the inner layers of multilayer PCBs. The default copper weight for inner layers is 1 oz.

 0.5oz 1oz 1.5oz 2oz 3oz 4oz
Via Process:

Via Process

The production process is based on your Gerber files. If you opt for Epoxy/Copper paste Filled & Capped, only untented vias with a diameter ≤ 0.3mm will be filled with epoxy resin. For tented vias, only those with a diameter ≤ 0.5mm will be filled. Please provide remarks when:
  1) Untented vias with diameters between 0.3mm and 0.5mm need to be filled.
  2) Untented vias with a diameter ≤ 0.3mm do not need to be filled.
  3) Tented vias with a diameter ≤ 0.5mm do not need to be filled.
  4) Specific via sizes or areas that require filling or not filling.
  5) Your Gerber file includes a via plugging/filling layer.
The corresponding pads for these vias will be modified to remain untented based on your design. It is recommended to include remarks indicating the specific via sizes or areas that require via filling or not filling, or to mention if your Gerber file includes a via plugging/filling layer.

 Tented Vias Untented Vias Plugged Vias Epoxy Filled & Capped Copper Paste Filled & Capped
Thermal Conductivity:

The thermal conductivity of aluminum PCB or copper base PCB refers to how well the material can transfer heat from a heat source. It is usually measured in watts per meter Kelvin (W/mK) and commonly represented by symbols like k, λ, or K.

 1.0W/(m·k) 1.5W/(m·k) 2.0W/(m·k) 3.0W/(m·k)
Thermal Conductivity:

The thermal conductivity of aluminum PCB or copper base PCB refers to how well the material can transfer heat from a heat source. It is usually measured in watts per meter Kelvin (W/mK) and commonly represented by symbols like k, λ, or K.

 380W
Withstand Voltage:

If the final product requires voltage resistance, please indicate it as a remark when placing the order.

 AC2500V AC3000V
Impedance Control:

To improve transmission speed, PCB conductors carry various signals. Impedance variations caused by factors like etching, layer thickness, and line width can distort the signals.

"Impedance control" ensures high-speed PCB conductors stay within a specific range. The typical tolerance is ±10%.

If impedance requirements are documented but not selected when placing the order, it will be considered as disregarding the impedance requirement.

 No Yes
Gold Fingers:

Gold fingers are the gold-plated contacts located along the connecting edges of PCBs. They are exclusively gold-plated when the ENIG surface finish is selected. However, if you choose the HASL surface finish, we will use HASL for the edge connector plating.

Gold Fingers

 No Yes
Remove Product No.:

CyberPCB will include our product number on the PCB to differentiate your PCBs from others.

If you wish to have it removed, an additional charge of $1.5 will apply.

If you prefer to have the product number placed in a specific location, please indicate the desired location by adding the text "CYBCYBCYB" in the silkscreen layer, the font size should be larger than 0.8mm in height and 5mil in width. There is no additional charge for this option.

Remove Product No.

 No Yes Specify a Location
Confirm Production file:

If you choose Yes, we'll email you the PCB production file, and production will proceed once you confirm. The lead time may be extended depending on the communication cycle.

 No Yes

Advanced Options

Special Techniques: Blind & Buried Vias

Blind and buried vias are employed to establish connections between layers within a PCB. The pricing for these vias will be determined manually based on your specific design.

 Edge Plating

Edge plating on PCB enhances durability, EMC performance, grounding, edge protection, EMI reduction, signal integrity improvement, and reliable electrical connections.

Edge plating

 Halogen-Free

As per the JPCA-ES-01-2003 standard, a halogen-free copper-clad laminate is defined as a laminate with chlorine (Cl) and bromine (Br) contents below 0.09% by weight each, and a total CI+Br amount ≤ 0.15% [1500PPM].

 Carbon Ink

Carbon ink is created by coating the PCB substrate with carbon-based conductive ink, which is then cured to form a carbon film conductive pattern. It offers several benefits, including low cost, excellent impedance control, high reliability, and strong corrosion resistance.

 Countersink/Counterbore

The main difference between a countersink and a counterbore lies in the size and shape of the holes they create, as well as the screws or tools used.

A counterbore hole is deeper and has a square-like shape, providing a space for the screw head's shoulder to rest. This type of hole also allows for the use of washers if needed.

Countersink Counterbore

 Peelable soldermask

Peelable soldermask, also known as peelable blue gel(pad), is primarily utilized for safeguarding the board's surface during production processes.

 Press-Fit Hole

Press-Fit holes are specifically designed to accommodate components with press-fit pins. These pins are inserted into the holes and firmly pressed to establish a reliable and secure connection.

Press-Fit Holes

 Black FR4

It is made from the standard FR-4 base material and follows the same processing technology as FR-4. This material is black, opaque, provides shading, and is well-suited for manufacturing LED display PCBs as well as insulation structural parts used in instruments and optical devices.

 Back Drilling

Back drilling, also known as Controlled Depth Drilling (CDD), is a technique used to eliminate the unused portion (stub) of the copper barrel in a through-hole (via) on a printed circuit board. This process involves drilling the holes to a specific and controlled depth. The goal is to ensure that the remaining via stub after back drilling is less than 10 mil.

Before back drilling
(Before back drilling)

After back drilling
(After back drilling)
Hole Copper Thickness:

Please choose the desired copper thickness for the holes you require.
Castellated Holes:

Castellations are plated through holes positioned along the edges of a printed circuit board. They are created by cutting through the board to form a series of half holes.

The minimum diameter for castellated holes is 0.60mm.

Castellated Holes
UL Marking:

To include UL marking on the board, please select the appropriate layer where you would like to add.
Board Outline Tolerance:

Regular and precision CNC routing methods primarily differ in the alignment process and the number of routing passes. 

In regular routing, the panel is secured at points outside individual PCBs, whereas precision routing utilizes alignment holes within each board for positioning. 

Regular routing involves a single-pass process, whereas precision routing consists of a rough pass followed by a fine pass.

For example, for a PCB with dimensions of 100mm x 80mm:

 ±0.2mm(Regular) ±0.1mm(Precision)
Test method:

We will do 100% electrical testing by flying probe and E-test machine.

 AOI + Flying test AOI + Fixture
+Add PO No.:
Other Requests：
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Pricing Information

Once all necessary parameters are provided, the price can be calculated.

Calculate
Note:
1. Please note that we will provide a revised quotation based on the review of your documents, and the final price may be subject to change accordingly.
2. If your specific requirements are not listed in the "Online Quote" section, please specify them in the "Other Requests" box.