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Premium PCB Quote

Base Material:

High density interconnects (HDI) Boards contain blind and/or buried vias and often contain micro vias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

 Through Hole Board HDI(Buried/Blind Vias)
Layers:

The number of copper layers in the board.

 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
FR4-TG:

TG stands for Glass Transition Temperature.

The typical TG is 130℃ or higher, while medium TG is generally greater than 150℃, and advanced TG is typically above 170℃. The material's temperature resistance improves as the TG increases.

 TG150(KB-6165F) TG170(KB-6167F) TG150(S1000H) TG170(S1000-2M)
Different Design:

Fill in how many different designs you have in your Gerber file, divided by V-cuts, stamp holes, or milled slots.
Example
Delivery Type:

The delivery type refers to the method by which you request CyberPCB to produce and deliver your PCB design.

Single PCB:  Your design will be produced and delivered as individual PCBs.

Panel by Customer:  You are responsible for constructing the PCB panel and providing us with the panelized data for production.

Panel by CyberPCB:  We will construct the panel for you, incorporating v-cuts based on your requirements. (Please note that we only offer panelizing services for PCBs with regular shapes such as rectangles and circles. For PCBs with irregular shapes, you will need to panelize them yourself.)

 Single Piece Panel By Customer Panel By CyberPCB
Size(Single):

The board size is determined by the customer and represents the length and width of the board. 

For circular boards, it corresponds to the diameter of the circle. 

In the case of boards with irregular shapes, the measurements are based on the maximum dimensions of the shape.
x
mm
inch'↔mm
 Example
Quantity(panel):

Quantity of single or panelized boards needed for the order.
sets

PCB Process Information

PCB Thickness:

 The board thickness represents the final thickness of the PCB after production, with an approximate error of 10% (+/-10% for T>=1mm or +/- 0.1mm for T<1mm). This error primarily stems from solder mask and copper sinking.

If you have specific thickness error requirements, kindly include them in the "Other Requirements" section.

PCB Thickness

 0.4 0.6 0.8 1.0 1.2 1.6 2.0 2.4 3.0 3.2
Solder Mask:

The solder mask color refers to the color applied to the surface of the PCB.

Green and white are the available default colors for the solder mask. Selecting any other color will incur an additional fee.

 Green White Yellow Blue Red Matt Black Black Purple Matt green param picture None
Silkscreen:

In most cases, the silkscreen is printed in white on the PCB. 

However, when using a white solder mask, the silkscreen is printed in black. 

It's important to note that the white silkscreen may appear less distinct on a gray surface. It is not recommended to have a silkscreen on the bare aluminum surface.

Silkscreen

 White Black param picture None
Surface Finish:

 Surface finish plays a crucial role in PCB production as it serves multiple purposes. Firstly, it acts as a protective layer to prevent copper oxidation, which could render the PCB non-functional. Secondly, it provides a smooth surface that facilitates the soldering of components onto the PCB.

HASL (Hot Air Solder Leveling) is a cost-effective surface finishing option that involves the application of a thin protective layer of tin/lead on the PCB.

ENIG (Electroless Nickel Immersion Gold) has emerged as the industry's preferred surface finish due to its advantages, including a flat surface, lead-free and RoHS compliance, extended shelf life, and the ability to maintain tighter tolerances for plated holes.

OSP(Organic Solderability Preservatives) is also known as anti-tarnish. It involves the formation of an organic protective layer on clean and bare copper through adsorption.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is a surface finish similar to ENIG (Electroless Nickel Immersion Gold) in that both processes involve the deposition of electroless nickel on top of copper plating. The key distinction is that while ENIG has gold directly deposited on top of the nickel layer, ENEPIG incorporates an additional layer of palladium between the nickel and final gold layer.

 HASL Lead Free ENIG(Immersion Gold) OSP Hard Gold Immersion Silver(Ag) Immersion Tin ENEPIG None(Plain Copper)
Thickness of Immersion Gold:

1U" 2U" 3U" 4U" 5U"
Thickness of ENEPIG: Ni:200U" Pd:2U" Au:2U" Ni:200U" Pd:3U" Au:3U" Ni:200U" Pd:4U" Au:4U"
Min Spacing:

 The minimum width of the copper trace and the minimum spacing between two traces.

Our engineers will verify the minimum spacing.

Min Spacing

 3/3mil 4/4mil 5/5mil 6/6mil↑ 8/8mil↑ 10/10mil↑ 20/20mil↑
Min Hole Size:

 The minimum via diameter.

Our engineers will verify the minimum hole size.

Min Hole Size

 0.15mm 0.2mm 0.25mm 0.3mm 0.4mm↑ 0.5mm↑ 0.6mm↑
Outer Copper:

The copper weight, measured in ounces per square foot, determines the thickness of copper on the outer layers of the PCB.

ps: 1oz=35um

 1oz 2oz 3oz 4oz 5oz 6oz
Inner Copper:

The copper weight refers to the amount of copper on the inner layers of multilayer PCBs.

ps: 1oz=35um

 0.5oz 1oz 1.5oz 2oz 3oz 4oz
Via Process:

 Via Process

The production process is based on your Gerber files. If you opt for Epoxy/Copper paste Filled & Capped, only untented vias with a diameter ≤ 0.3mm will be filled with epoxy resin. For tented vias, only those with a diameter ≤ 0.5mm will be filled. Please provide remarks when:
  1) Untented vias with diameters between 0.3mm and 0.5mm need to be filled.
  2) Untented vias with a diameter ≤ 0.3mm do not need to be filled.
  3) Tented vias with a diameter ≤ 0.5mm do not need to be filled.
  4) Specific via sizes or areas that require filling or not filling.
  5) Your Gerber file includes a via plugging/filling layer.
The corresponding pads for these vias will be modified to remain untented based on your design. It is recommended to include remarks indicating the specific via sizes or areas that require via filling or not filling, or to mention if your Gerber file includes a via plugging/filling layer.

 Tented Vias Untented Vias Plugged Vias Epoxy Filled & Capped Copper Paste Filled & Capped
IPC Level: IPC-II IPC-III
Contains BGA:

BGA stands for Ball Grid Array, which is a type of packaging used to connect integrated circuits and PCBs using surface mount technology.

 No Yes
BGA Pads Spacing: >0.4mm(16mil) =0.4mm(16mil) <0.4mm(16mil)
Impedance Control:

To improve transmission speed, PCB conductors carry various signals. Impedance variations caused by factors like etching, layer thickness, and line width can distort the signals.

"Impedance control" ensures high-speed PCB conductors stay within a specific range. The typical tolerance is ±10%.

If impedance requirements are documented but not selected when placing the order, it will be considered as disregarding the impedance requirement.

 No Yes
Impedance Control Report: No Yes
Gold Fingers:

 Gold fingers are the gold-plated contacts located along the connecting edges of PCBs. They are exclusively gold-plated when the ENIG surface finish is selected. However, if you choose the HASL surface finish, we will use HASL for the edge connector plating.

Gold Fingers

 No Yes
Confirm Production File:

If you choose Yes, we'll email you the PCB production file, and production will proceed once you confirm. The lead time may be extended depending on the communication cycle.

 No Yes
Test method:

To detect open and short circuit issues, testing will be conducted on all PCBs. A test rack will be provided for batch orders.

 Flying Probe Test Test Rack

Advanced Options

Special Techniques: Edge Plating

 Edge plating on PCB enhances durability, EMC performance, grounding, edge protection, EMI reduction, signal integrity improvement, and reliable electrical connections.

Edge plating

 Carbon Ink

Carbon ink is created by coating the PCB substrate with carbon-based conductive ink, which is then cured to form a carbon film conductive pattern. It offers several benefits, including low cost, excellent impedance control, high reliability, and strong corrosion resistance.
UL Mark:

UL logo selection default for UL + week / year, if you do not choose, we will default to you do not need,please choose according to your needs.

 UL+Week/Year UL+Year/Week None example image
+Add PO No.:
Other Requests：
PCB Assembly Quote The PCBs above need assembly
SMD-Stencil Quote Order together with PCB
Border Type: Framework Non-framework
Stencil Type:

1. Stencil for Adhesives: First print the adhesives, then add the components, and after the components are firmly adhered to the PCB, the plug-in components are placed and wave soldered together;2.Stencil for Solder Paste: Directly print solder paste on the pad, paste the SMD components, and reflow soldering in a unified way, and the plug-in components are manually welded;3. Step Down Stencil: Due to the different requirements for the amount of solder paste when welding various components on the PCB, ordinary laser stencils can only achieve the purpose of controlling the amount of solder paste through the size of the openings.

 Stencil for Solder Paste Stencil for Adhesives Step Down Stencil
Printing Method:

1.Fully automatic printing:Most of the fully automatic printed solder paste stencils use MARK point half a quarter;2. Hand-printed and semi-automatically printed solder paste stencils can be used without MARK points,

 Semi-automatic Printing Fully Automatic Printing Manual Printing
Size(mm):

The stencil valid area size should be bigger than your PCB size.
Size(mm):

The stencil valid area size should be bigger than your PCB size.
Size(mm):

The stencil valid area size should be bigger than your PCBsize
Size(mm):

The stencil valid area size should be bigger than your PCB size.
Stencil Side:

Depending on your PCB that how many side need to be soldered.

 Top Bottom Top & Bottom Top & Bottom ( Different Solder Paste )
Quantity:
pcs
Thickness: 0.10mm 0.12mm 0.15mm 0.2mm
Existing Fiducials:

Fiducial Mark is an alignment mark for surface mount assembly machines.In General,machine assembly must have Fiducial marks.Fiducial marks are unnecessary when you are placing your parts by hand.

 None Half lasered Lasered through
Electropolishing:

It is called BGA plating, is highly recommended for boards with BGAs or the pin to pin spacing on a ICis less than/equal to 0.5mm,as it will help the paste detach from the fine stencil apertures.

 NO YES
+Add PO No.:
Other Requests：
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Pricing Information

Once all necessary parameters are provided, the price can be calculated.

Calculate
Note:
1. Please note that we will provide a revised quotation based on the review of your documents, and the final price may be subject to change accordingly.
2. If your specific requirements are not listed in the "Online Quote" section, please specify them in the "Other Requests" box.