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As used product No.:

PCB Specifications

Material: ?

High density interconnects (HDI) Boards contain blind and/or buried vias and often contain micro vias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

Through hole board HDI(Buried/blind vias)
BoardSpec: ?

Standards are required to produce PCBs

IPC 6012 Class 2 IPC 6012 Class 3 IATF16949 ISO13485 Customer Standard
Board type: ?

PCBs will be shipped in single pieces or in panel. For bulk assembly orders (quantity greater than 30), we recommend shipping in panel, which will improve the assembly efficiency.

Single piece Panel by Customer Panel by CyberPCB
Different Design in Panel: ?

It means there are different designs in your files separated by v-cuts, stamp holes, milling slots or others. We willl charge additional panel cost if there are different kinds of PCB designs in one Gerber file.

Example
Size(Single): ?

The board size refers to the length and width of the board ordered by the customer. If it is a circular board, the length and width are the diameter of the circle; If it is a board with irregular shape, the length and width are measured according to the largest shape range.

x
mm
inch'↔mm
Example
Panel Type:
pc
x
pc
Quantity(panel): ?

Please choose the number of single pieces you need. For standard PCB, the starting quantity is 5 pieces.

sets
X-out Panel: ?

Bad PCBs may exist in the panel, the quotation will increase by about 10% if X-out Allowance is not accepted.

Accept Not Accept
Panel Cutting: ?

The separating way in the panel PCB. For PCB size is smaller than 80*80mm, we advise selecting tab-routing

V-Scoring Tab-Routing V-Scoring+Tab-Routing None Example
Layer Count: ?

The number of copper layers in the board. PCBWay can currently produce up to 60 layers, if you need more than 14 layers, please select the advanced PCB page for valuation.

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60
TG: ?

FR4 is the most common arade dielectric material that is used in the fabrication of circu boards. Aluminum boards have better heat dissipation and thermal transfer than standard FR-4 constructions. The copper base boards have a great thermal conductivity better than aluminum PCB. Due to its characteristics of low dielectric loss, Rogers is often used in high-frequency PCB. If you need other materials, please contact your sales representative.

TG140 TG150 TG170 Tg150(Halogen-free) Tg170(Halogen-free) High-CTI(>=600V) High-CTI(Halogen-free,>=600V) ≈High Speed(GHz) ≡High Frequency PCBs(DK) Special Material(High low temperature)
High Speed(GHz): ?

High Speed(GHz)

1-5G 5-10G 10-25G > 25G None
High Frequency PCBs(DK): ?

High Frequency PCBs(DK)

2.2-2.25 2.33 2.45 2.5-2.55 2.7-2.75 2.92-2.94 2.95 3.0 3.2-3.28 3.37-3.38 3.48-3.5 3.6 4.5 6.0 6.15 9.2-9.8 10.0-10.2 None
Thickness: ?

For ordinary materials, the board thickness refers to the thickness of the PCB after production is complete, and the error is about 10% (+/-10% (T>=1mm) or +/- 0.1mm (T<1mm).). The error is mainly caused by solder mask and copper sinking. If there are other requirements for thickness error, please make a note in Other Special Requirements. Note: For single sided/double sided Rogers board, the thickness refers to thickness of substrate.

0.2 0.4 0.6 0.8 1.0 1.2 1.6 2.0 2.4 2.8 3.0 3.2 3.6 4.0 4.4 4.8 5.2 5.6 6.0
Min Track/Spacing: ?

Minimum width of the copper trace and minimum distance between two traces. PCBWay engineers will double-check the Min Track/Spacing.

3.5/3.5mil↑ 4/4mil↑ 5/5mil↑ 6/6mil↑ 8/8mil↑ 10/10mil↑
Min Hole Size: ?

Minimum diameter of holes. PCBWay engineers will double-check the Min Hole Size.

0.15mm↑ 0.2mm↑ 0.25mm↑ 0.3mm↑
Solder Mask: ?

Solder mask color refers to the color of the PCB surface. Currently, PCBWay provides 9 conventional solder mask colors. If you need pink, gray, orange, or transparent, please go to the Advanced PCB page to choose.

Green Red Yellow Blue White Black Pink Grey Orange Transparent Purple Matte black Matt green None
Silkscreen: ?

The silkscreen is a layer of ink trace used to identify the PCB components, marks, logos, symbols, and so on. The color is usually white. But when the solder mask ink is white, the silkscreen will be black.

White Black Yellow Blue Grey None
Edge connector: ?

Also called gold-finger. It is a type of edge connector used on PCBs. It is a metal-plated edge that is designed to make electrical contact with a mating connector.

Yes No
Beveling of G/F: ?

Bevelling of the gold finger is the process of creating a beveled edge on the gold finger of a PCB, which can make the PCB enter the connector easier, and finally build an excellent electrical connection.

No 20° 30° 45°
Surface Finish of G/F: ?

The options are only Edge connector Surface Finish

HASL lead free ENIG OSP Hard gold Immersion silver(Ag) Immersion Tin ENEPIG None(Plain copper)
Thickness of Immersion Gold: 2U" 3U"
Au/Ni thickness: Au:5U"/Ni:120U" Au:10U"/Ni:120U" Au:15U"/Ni:120U" Au:20U"/Ni:120U" Au:25U"/Ni:120U" Au:30U"/Ni:120U"
Thickness of ENEPIG: Ni:200U" Pd:2U" Au:2U" Ni:200U" Pd:3U" Au:3U" Ni:200U" Pd:4U" Au:4U"
Surface Finish: ?

Surface finish is an important part of PCB production. It can protect the copper from oxidation, which would render the PCB unusable. In addition, it provides a smooth surface for the components to be soldered.

HASL lead free ENIG OSP Hard gold Immersion silver(Ag) Immersion Tin ENEPIG None(Plain copper)
Thickness of Immersion Gold: 2U" 3U"
Au/Ni thickness: Au:5U"/Ni:120U" Au:10U"/Ni:120U" Au:15U"/Ni:120U" Au:20U"/Ni:120U" Au:25U"/Ni:120U" Au:30U"/Ni:120U"
Thickness of ENEPIG: Ni:200U" Pd:2U" Au:2U" Ni:200U" Pd:3U" Au:3U" Ni:200U" Pd:4U" Au:4U"
Finished Copper: ?

The weight in ounces of copper in one square foot of PCB, this option will determine the thickness of copper on the outer layers. CyberPCB provides the thickness of copper on outer layers of 1-13oz.

0.5oz 1oz 2oz 3oz 4oz 5oz 6oz 7oz 8oz 9oz 10oz 11oz 12oz 13oz
Inner Copper: ?

The copper weight on the inner layers for multilayer PCBs. The default inner copper weight is 1 oz.

1oz 1.5oz 2oz 3oz 4oz 5oz 6oz
UL Mark: ?

UL logo selection default for UL + week / year, if you do not choose, we will default to you do not need,please choose according to your needs.

UL+Week/Year UL+Year/Week None Example

Customized Options

Half-cut/Castellated Holes ?

PTH holes or vias that are cutted through to create a partial or half hole to form an opening into the side of the hole barrel. Generally they are used for mounting a PCB to another one.

Edge Plating ?

PCB edge plating refers to the metallization of the sides of a printed circuit board across its height.You can carry out edge plating on just one of the board edges or all round. Through edge plating,your equip the board with a reliable connection and rigidity.

Impedance control ?

Conductors in a PCB carry various signals, and to increase their transmission speed, their frequency must be raised. However, factors such as etching, layer thickness, and line width can cause impedance variations in the PCB, leading to signal distortion. Therefore, for high-speed PCB conductors, their impedance values should be controlled within a certain range, known as "impedance control". The impedance tolerance is generally ±10%. If impedance requirements are specified in the documentation but not selected in the order, it will be regarded as ignoring the impedance requirement.

Custom Stackup ?

Apply to multilayer PCBs only. If you need to customize a specific stack-up, please upload the stack-up file together or contact your sales representative.

Carbon ink ?

Also called carbon oil PCB. Carbon ink PCB is coated on the PCB substrate with carbon-based conductive ink (referred to as carbon ink), cured to form a PCB with a carbon film conductive pattern. Carbon ink PCB has the advantages of low cost, strong impedance control ability, high reliability, and good corrosion resistance.

All vias filled with resin and capped ?

If you check this option, all vias will be filled with resin,then capped and plated cover.

Via in pad ?

If there are via in pad in your design, that is, vias in the SMD pad, check this option and we will perform resin plug,then capped and plated cover.

Countersink/Counterbore ?

The most noted difference between a countersink and counterbore is the size and shape of the screw or the tool which creates the holes in the material. A counterbore hole is deeper and has a square-like shape where the shoulder of the screw head can seat. It also allows for the addition of washers to be used.

Z-axis milling ?

It is also known as depth control routing(milling) or level milling, it refers to partial routing in PCB with a variable level elevation at the PCB edge or within PCB.

Press-fit holes ?

Press-fit holes are holes are designed to accept components with press-fit pins. The pins are inserted into the holes and then pressed into place to create a secure connection. Tolerance:+/-0.05mm.

Embedded Copper PCB ?

Embedded copper PCBs are printed circuit boards that have copper traces embedded within the substrate material. The design of buried copper blocks can be mainly divided into two categories: buried copper blocks and embedded copper blocks. Buried copper blocks refer to copper blocks that are buried with a thickness less than the total thickness of the board, with one side of the copper block flush with the bottom layer and the other side flush with a certain inner layer, as shown in Figure 1 (semi-buried copper block). Embedded copper blocks refer to copper blocks that are embedded with a thickness close to or equal to the total thickness of the board, with the copper block passing through the top layer, as shown in Figure 2 (through-hole copper block). Printed circuit boards with buried or embedded copper blocks have the characteristics of high thermal conductivity, high heat dissipation, and saving board space, which can effectively solve the heat dissipation problem of high-power electronic components.

Embedded Capacitor/Resistor PCB ?

The buried capacitance technique is mainly used to embed a capacitance material (also known as a buried capacitance material) into the interior of a PCB through etching and lamination, forming a structure where a layer of dielectric material is sandwiched between two layers of copper foil. The buried resistor technique involves pressing a special resistor material onto an insulating substrate to form a flat resistor layer as required by the design. Buried capacitance and buried resistor technologies represent an unprecedented technological revolution in PCB design and manufacturing, offering advantages in high-density/high-speed transmission circuits design such as improved impedance matching, reduced parasitic inductance, reduced solder joints, and increased PCB stability, as well as enabling smaller PCB sizes.

Cavity PCB ?

Cavity PCB is a type of PCB that features one or multiple recessed grooves or cavities on its surface. These grooves are created by removing a portion of the board material, leaving behind a depressed area where components can be placed deeper, and finally reducing the overall height of the device. Cavity PCB and back drilling PCB are two different technologies, back drilling refers to drilling holes for vias, which stops at a certain depth and does not penetrate through the board, while cavity PCB refers to a specific area on the PCB.

Semi-Flex PCB ?

Semi-flex PCB is a kind of PCB that can be locally bent on the basis of rigid PCB, which can not only provide the support of rigid PCB, but also achieve local bending according to product requirements, including the bending in 45°, 90°, 180°, meeting the installation performance requirements of various types of 3D assembly.

Whole/Partially Hybrid PCB ?

Hybrid PCB utilizes different materials to build the substrate core layers and also the dielectric layers. Rather than using one material, the fabrication of hybrid PCB involves the use of different materials. Different materials are used to combine all positives into the manufacturing process of the PCB and reduce the negatives that a particular material may feature.

Back Drill PCB ?

Back drilling (sometimes called controlled depth drilling or CDD) involves using a drill bit slightly larger in diameter than the PTH to remove the conductive plating or stub from the hole.The back drilled hole should bring down the stub length to 10 mils.If the stubs are greater than 10 mils,then signal reflections will be produced.

Leadless Partially Plated Hard Gold ?

This is an electronic component surface treatment technology that is lead-free and selectively electroplated in certain areas to provide high levels of conductivity and durability.

+Add PO No.:
Special Requests:
PCB Assembly Quote The PCBs above need assembly
SMD-Stencil Quote Order together with PCB
Border Type: Framework Non-framework
Stencil Type: ?

1. Stencil for Adhesives: First print the adhesives, then add the components, and after the components are firmly adhered to the PCB, the plug-in components are placed and wave soldered together;2.Stencil for Solder Paste: Directly print solder paste on the pad, paste the SMD components, and reflow soldering in a unified way, and the plug-in components are manually welded;3. Step Down Stencil: Due to the different requirements for the amount of solder paste when welding various components on the PCB, ordinary laser stencils can only achieve the purpose of controlling the amount of solder paste through the size of the openings.

Stencil for Solder Paste Stencil for Adhesives Step Down Stencil
Printing Method: ?

1.Fully automatic printing:Most of the fully automatic printed solder paste stencils use MARK point half a quarter;2. Hand-printed and semi-automatically printed solder paste stencils can be used without MARK points,

Semi-automatic Printing Fully Automatic Printing Manual Printing
Size(mm): ?

The stencil valid area size should be bigger than your PCB size.

Size(mm): ?

The stencil valid area size should be bigger than your PCB size.

Size(mm): ?

The stencil valid area size should be bigger than your PCBsize

Size(mm): ?

The stencil valid area size should be bigger than your PCB size.

Stencil Side: ?

Depending on your PCB that how many side need to be soldered.

Top Bottom Top & Bottom Top & Bottom ( Different Solder Paste )
Quantity:
pcs
Thickness: 0.10mm 0.12mm 0.15mm 0.2mm
Existing Fiducials: ?

Fiducial Mark is an alignment mark for surface mount assembly machines.In General,machine assembly must have Fiducial marks.Fiducial marks are unnecessary when you are placing your parts by hand.

None Half lasered Lasered through
Electropolishing: ?

It is called BGA plating, is highly recommended for boards with BGAs or the pin to pin spacing on a ICis less than/equal to 0.5mm,as it will help the paste detach from the fine stencil apertures.

NO YES
+Add PO No.:
Special Requests:
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Pricing Information

Once all necessary parameters are provided, the price can be calculated.

Note:
1. Please note that we will provide a revised quotation based on the review of your documents, and the final price may be subject to change accordingly.
2. If your specific requirements are not listed in the "Online Quote" section, please specify them in the "Special Requests" box.